Future-Ready Electronics Start With Precision Testing
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Future-Ready Electronics Start With Precision Testing

The electronics industry is entering a new phase of rapid expansion. From consumer devices and electric vehicles to smart manufacturing systems, demand is growing for high-performance components that are smaller, lighter, and more reliable.
As factories embrace automation and next-generation technologies, material selection and process reliability have become critical drivers of innovation and competitiveness. With this shift, manufacturers face increasing pressure to ensure materials perform consistently under thermal, mechanical, and environmental stress.
The ability to characterize material behavior with precision is no longer a lab exercise. It’s a strategic necessity that shapes product success in the real world.

Optimization of Photoresist Adhesion Through Contact Angle Measurement
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Optimization of Photoresist Adhesion Through Contact Angle Measurement

In semiconductor manufacturing, the adhesion of photoresist materials to substrates is a critical factor that can significantly impact the quality and yield of the final product. Understanding and optimizing this adhesion can lead to better performance and fewer defects in microelectronic devices. This blog post explores how contact angle measurements can be used to optimize photoresist adhesion.

How To Utilize the Rotational Stage for Automated Wafer Mapping?
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How To Utilize the Rotational Stage for Automated Wafer Mapping?

Contact angle measurements on silicon and other wafers in the semiconductor industry are used to evaluate the cleanliness, surface treatment homogeneity, and photoresist adhesion. Wafers range typically from 4” up to 12” in diameter. Ideally, the contact angle measurement on a wafer can be done by automatic mapping of the whole wafer without user interference….

Wafer Cleaning Process – RCA Cleaning and Contact Angle
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Wafer Cleaning Process – RCA Cleaning and Contact Angle

In semiconductor manufacturing, maintaining the purity and integrity of silicon wafers is crucial. This is where the RCA cleaning process comes into play. RCA cleaning was developed by the Radio Corporation of America which is where the acronym comes from. RCA Clean is a standard protocol used to remove organic and inorganic contaminants from silicon…

Insights on Current Market Dynamics and Outlook in the Scientific Instruments Industry 
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Insights on Current Market Dynamics and Outlook in the Scientific Instruments Industry 

The recent analytica 2024 trade fair in Munich, Germany, emerged as a pinnacle event in the international laboratory sector. The highly anticipated tradeshow drew a crowd of over 34,000 industry professionals, featured 185 presentations, and showcased 1,066 exhibitors, including DKSH Technology.

Surface Tension of Electroplating Bath
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Surface Tension of Electroplating Bath

Electroplating is a technique that deposits a thin layer of metal onto a conductive surface using an electrical current. This process involves a bath, or solution, containing ions of the metal being deposited, and an electrical circuit comprising the object to be plated (the cathode), a source of the plating metal (the anode), and an electrolyte solution. Surface tension plays an important role in the electroplating solution.

Why QCM-D Is the Preferred Real-Time Method for Surface Analysis 
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Why QCM-D Is the Preferred Real-Time Method for Surface Analysis 

For centuries, people have been researching and developing different types of surfaces for different applications known as surface modifications. As a result, today we have self-cleaning windows, superhydrophobic glass, cell-friendly implants, and scratch-resistant surfaces.