As chip technology continues to advance, the coatings that protect and shape each wafer need to keep up as well. These days, R&D teams are not only focused on making new coatings but also on deeply understanding what is happening at the surface level. Even small variations in surface energy, cleanliness, or texture can affect…
Anna Junnila, Nov 25, 2025 PFAS (per- and polyfluoroalkyl substances) have set the standard for water, oil, and stain repellency in coatings for decades, thanks to their unique chemical properties and durability. However, increasing awareness of their environmental persistence and potential health risks has prompted regulatory action and a global movement toward safer, more sustainable…
Author: Susanna Laurén, Application Scientist at Biolin Scientific In the rapidly evolving field of biomedical engineering, the performance and safety of medical devices are paramount. From implants and catheters to diagnostic sensors and wound dressings, the interaction between a device’s surface and its biological environment can make the difference between success and failure. One of…
Developing high-performance cleaning products requires more than just knowing what’s left behind after cleaning. To truly optimize formulations and protocols, it’s essential to understand how cleaning happens—moment by moment—under realistic conditions. Traditional “before-and-after” tests can’t deliver this level of insight, often leaving knowledge gaps that can slow down development and innovation. QCM-D (Quartz Crystal Microbalance…
The electronics industry is entering a new phase of rapid expansion. From consumer devices and electric vehicles to smart manufacturing systems, demand is growing for high-performance components that are smaller, lighter, and more reliable.
As factories embrace automation and next-generation technologies, material selection and process reliability have become critical drivers of innovation and competitiveness. With this shift, manufacturers face increasing pressure to ensure materials perform consistently under thermal, mechanical, and environmental stress.
The ability to characterize material behavior with precision is no longer a lab exercise. It’s a strategic necessity that shapes product success in the real world.
In semiconductor manufacturing, the adhesion of photoresist materials to substrates is a critical factor that can significantly impact the quality and yield of the final product. Understanding and optimizing this adhesion can lead to better performance and fewer defects in microelectronic devices. This blog post explores how contact angle measurements can be used to optimize photoresist adhesion.
Contact angle measurements on silicon and other wafers in the semiconductor industry are used to evaluate the cleanliness, surface treatment homogeneity, and photoresist adhesion. Wafers range typically from 4” up to 12” in diameter. Ideally, the contact angle measurement on a wafer can be done by automatic mapping of the whole wafer without user interference….
In semiconductor manufacturing, maintaining the purity and integrity of silicon wafers is crucial. This is where the RCA cleaning process comes into play. RCA cleaning was developed by the Radio Corporation of America which is where the acronym comes from. RCA Clean is a standard protocol used to remove organic and inorganic contaminants from silicon…
With the solar sector growing in Vietnam, DKSH provided a solar wafer manufacturer with advanced technology and solutions that boosted its capabilities and positioned it as an industry leader.
The collaboration between the Royal University of Phnom Penh and DKSH has provided advanced instruments to Cambodian researchers, greatly enhancing their studies in optoelectronics and advanced materials.
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