Optimization of Photoresist Adhesion Through Contact Angle Measurement
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Optimization of Photoresist Adhesion Through Contact Angle Measurement

In semiconductor manufacturing, the adhesion of photoresist materials to substrates is a critical factor that can significantly impact the quality and yield of the final product. Understanding and optimizing this adhesion can lead to better performance and fewer defects in microelectronic devices. This blog post explores how contact angle measurements can be used to optimize photoresist adhesion.

How To Utilize the Rotational Stage for Automated Wafer Mapping?
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How To Utilize the Rotational Stage for Automated Wafer Mapping?

Contact angle measurements on silicon and other wafers in the semiconductor industry are used to evaluate the cleanliness, surface treatment homogeneity, and photoresist adhesion. Wafers range typically from 4” up to 12” in diameter. Ideally, the contact angle measurement on a wafer can be done by automatic mapping of the whole wafer without user interference….

Wafer Cleaning Process – RCA Cleaning and Contact Angle
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Wafer Cleaning Process – RCA Cleaning and Contact Angle

In semiconductor manufacturing, maintaining the purity and integrity of silicon wafers is crucial. This is where the RCA cleaning process comes into play. RCA cleaning was developed by the Radio Corporation of America which is where the acronym comes from. RCA Clean is a standard protocol used to remove organic and inorganic contaminants from silicon…

Biopharmaceutical Research & Development – Top 5 QSense Sensors
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Biopharmaceutical Research & Development – Top 5 QSense Sensors

In the rapidly evolving field of biopharmaceutical research and development, understanding the interactions between drugs and various surfaces is crucial. QSense QCM-D technology is a powerful method for analyzing these interactions, providing insights that can help mitigate potential challenges during drug manufacturing, storage, and administration. Here, we highlight the top five QSense sensors that are particularly valuable…

Thermal Analysis of Food Coloring Material by DSC
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Thermal Analysis of Food Coloring Material by DSC

Did you know that food coloring’s thermal properties, such as its crystallization and melting, affect features like solubility and taste? Understanding these properties helps optimize production processes and quality control in the food industry. Abstract Food coloring material makes the food more attractive for the user. Food coloring materials are used in many areas: processed…

Estimation of Polymer Lifetime by TGA Decomposition Kinetics
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Estimation of Polymer Lifetime by TGA Decomposition Kinetics

Estimating polymer lifetime is critical for applications where long-term reliability matters, such as insulation materials in nuclear reactors and power systems. Traditional methods can take months, but Thermogravimetric Analysis (TGA) offers a faster alternative. ABSTRACT In many polymer applications the ability to predict product lifetime is valuable because the costs of premature failure in actual…

Indenting Glasses With Indenters of Varying Stiffness and Sharpness
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Indenting Glasses With Indenters of Varying Stiffness and Sharpness

A group of researchers developed a spray coating method that maintained transparency while possessing superhydrophobic properties. The team quantified the surface roughness using AFM, which complemented optical microscopy, TEM and SEM. Author Johan F.S. Christensen, N.M. Anoop Krishnan, Mathieu Bauchy, Morten M. Smedskjaer Abstract In this study, the effects of both indenter sharpness and stiffness on the indentation response of oxide glasses…

Surface Tension of Electroplating Bath
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Surface Tension of Electroplating Bath

Electroplating is a technique that deposits a thin layer of metal onto a conductive surface using an electrical current. This process involves a bath, or solution, containing ions of the metal being deposited, and an electrical circuit comprising the object to be plated (the cathode), a source of the plating metal (the anode), and an electrolyte solution. Surface tension plays an important role in the electroplating solution.

Interpreting Unexpected Events and Transitions in DSC Results
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Interpreting Unexpected Events and Transitions in DSC Results

Downloads Application of Interpreting Unexpected Events and Transitions in DSC Results (PDF, 599 KB) The purpose of this paper is to assist DSC users with interpretation of unusual or unexpected transitions in DSC results. The transitions discussed in the paper are several of the ones that most frequently create problems for the new user, and…