Lithium plating and dendrite formation remain among the most challenging safety issues in battery development. Traditional testing methods detect problems after thermal runaway begins – but what if you could spot the warning signs days earlier?
The electronics industry is entering a new phase of rapid expansion. From consumer devices and electric vehicles to smart manufacturing systems, demand is growing for high-performance components that are smaller, lighter, and more reliable.
As factories embrace automation and next-generation technologies, material selection and process reliability have become critical drivers of innovation and competitiveness. With this shift, manufacturers face increasing pressure to ensure materials perform consistently under thermal, mechanical, and environmental stress.
The ability to characterize material behavior with precision is no longer a lab exercise. It’s a strategic necessity that shapes product success in the real world.
In semiconductor manufacturing, the adhesion of photoresist materials to substrates is a critical factor that can significantly impact the quality and yield of the final product. Understanding and optimizing this adhesion can lead to better performance and fewer defects in microelectronic devices. This blog post explores how contact angle measurements can be used to optimize photoresist adhesion.
The Asia-Pacific region is at the forefront of the global business-to-business (B2B) eCommerce revolution, driven by rapid digital transformation and the increasing adoption of digital procurement solutions. The region’s eCommerce market is projected to grow at an impressive compound annual growth rate (CAGR) of 22.74% from 2023 to 2032, reaching USD 121 trillion in revenue.
Contact angle measurements on silicon and other wafers in the semiconductor industry are used to evaluate the cleanliness, surface treatment homogeneity, and photoresist adhesion. Wafers range typically from 4” up to 12” in diameter. Ideally, the contact angle measurement on a wafer can be done by automatic mapping of the whole wafer without user interference….
In semiconductor manufacturing, maintaining the purity and integrity of silicon wafers is crucial. This is where the RCA cleaning process comes into play. RCA cleaning was developed by the Radio Corporation of America which is where the acronym comes from. RCA Clean is a standard protocol used to remove organic and inorganic contaminants from silicon…
The successful introduction of the Novasina LabMaster Neo highlights DKSH Korea’s ability to anticipate market trends, respond proactively to regulatory changes, and execute innovative strategies. This approach resulted in the sale of over 50 devices within a short period.
In the rapidly evolving field of biopharmaceutical research and development, understanding the interactions between drugs and various surfaces is crucial. QSense QCM-D technology is a powerful method for analyzing these interactions, providing insights that can help mitigate potential challenges during drug manufacturing, storage, and administration. Here, we highlight the top five QSense sensors that are particularly valuable…
Did you know that food coloring’s thermal properties, such as its crystallization and melting, affect features like solubility and taste? Understanding these properties helps optimize production processes and quality control in the food industry. Abstract Food coloring material makes the food more attractive for the user. Food coloring materials are used in many areas: processed…
Estimating polymer lifetime is critical for applications where long-term reliability matters, such as insulation materials in nuclear reactors and power systems. Traditional methods can take months, but Thermogravimetric Analysis (TGA) offers a faster alternative. ABSTRACT In many polymer applications the ability to predict product lifetime is valuable because the costs of premature failure in actual…
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